AIM NC259FPA Ultra-Fine No-Clean Solder Paste

AIM NC259FPAUltra-Fine No-Clean Solder Paste is specifically formulated for Type 6 and finer solder powders. This solder paste offers high transfer efficiency and precise printing definition. The NC259FPA activator system enhances wetting on various surface finishes, achieving shear force values up to 150 gf. It also provides residues with high Surface Insulation Resistance (SIR) values and a clean appearance. NC259FPA is designed to deliver the tack force required for effective mass transfer assembly.

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AIM NC259FPASolder Paste Applications: MiniLED and MicroLED assembly; small and/or complex die attach in semiconductor assembly; micro BGA assembly; any application relying on print apertures ≤ 70 µm; dispensing applications such as jet printing; high-density interconnect (HDI) boards.